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| 1. product profile 1.1 general description the ld6805 series is a small-size low-dropout regulator (ldo) family with ultra high power supply rejection ratio (psrr) of 75 db and a voltage drop of 250 mv at 150 ma current rating. the devices are available in a huson4 qfn plastic package. the operating voltage ranges from 2.3 v to 5.5 v and the output voltage ranges from 1.2 v to 3.6 v. all devices use the same regulator design and are manufactured in monolithic silicon technology. these features make the ld6805 series ideal for use in applications requiring component miniaturization, such as mob ile phone handsets, cordless te lephones and personal digital devices. 1.2 features and benefits ? input voltage range 2.3 v to 5.5 v ? output voltage range 1.2 v to 3.6 v ? dropout voltage 250 mv at 150 ma output rating ? low quiescent current in shutdown mode (typical 0.1 ? a) ? 40 ? v rms output noise voltage (typical value) at 10 hz to 100 khz ? turn-on time 200 ? s ? 75 db psrr at 1 khz ? LD6805K/xxh: high-ohmic (3-state) output state when disabled ? LD6805K/xxp: low-ohmic output state when disabled ? integrated esd protection of 6 kv human body model ? huson4 qfn plastic package ? pb-free, rohs compliant and free of halogen and antimony (dark green compliant) 1.3 applications ? analog and digital interfaces requiring lower than standard supply voltage in mobile appliances such as mobile phones, media players and so on. ld6805 series low-dropout regulators, low noise, 150 ma rev. 1 ? 22 september 2011 objective data sheet
ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 2 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 2. pinning information 2.1 pinning 2.2 pin description [1] the tab is gnd level (it is placed on the reverse side of the ic). the tab should be connected to the gnd, but leaving open is also allowed. 3. ordering information fig 1. pin configuration for huson4 001aan948 ld6805 transparent top view 2 3 1 4 out in gnd en table 1. pin description huson4 symbol pin description out 1 regulator output voltage gnd 2 supply ground en 3 device enable input; active high in 4 regulator input voltage i.c. tab internal connected [1] table 2. ordering information type number package name description version LD6805K/xxh huson4 plastic thermal enhanced ultra thin small outline package; no leads; 4 terminals; body 1 ? 1 ? 0.55 mm sot1194-1 LD6805K/xxp huson4 plastic thermal enhanced ultra thin small outline package; no leads; 4 terminals; body 1 ? 1 ? 0.55 mm sot1194-1 ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 3 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 3.1 ordering options further information on output voltag e is available on request; see section 19 ? contact information ? table 3. type number extension of high ohmic output type number nominal output voltage type number nominal output voltage LD6805K/12h 1.2 v LD6805K/23h 2.3 v LD6805K/13h 1.3 v LD6805K/25h 2.5 v LD6805K/14h 1.4 v LD6805K/28h 2.8 v LD6805K/16h 1.6 v LD6805K/29h 2.9 v LD6805K/18h 1.8 v LD6805K/30h 3.0 v LD6805K/20h 2.0 v LD6805K/33h 3.3 v LD6805K/22h 2.2 v LD6805K/36h 3.6 v table 4. type number extension of pull-down output type number nominal output voltage type number nominal output voltage LD6805K/12p 1.2 v LD6805K/23p 2.3 v LD6805K/13p 1.3 v LD6805K/25p 2.5 v LD6805K/14p 1.4 v LD6805K/28p 2.8 v LD6805K/16p 1.6 v LD6805K/29p 2.9 v LD6805K/18p 1.8 v LD6805K/30p 3.0 v LD6805K/20p 2.0 v LD6805K/33p 3.3 v LD6805K/22p 2.2 v LD6805K/36p 3.6 v ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 4 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 4. block diagram fig 2. block diagram of LD6805Kxxh fig 3. block diagram of LD6805Kxxp 001aan873 over current protection v reference generator v in v out gnd r2 r1 v en 001aan755 over current protection v reference generator v in v out gnd r2 r1 v en ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 5 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 5. limiting values [1] the (absolute) maximum power dissipa tion depends on the junction temperature t j . higher power dissipation is allowed with lower ambient temperatures. the conditions to determine the specified values are t amb = 25 c and the use of a two layer pcb. [2] according to iec 61340-3-1. [3] according to jesd22-a115c. 6. recommended operating conditions [1] see section 10.1 ? output capacitor values ? . 7. thermal characteristics [1] the overall r th(j-a) can vary depending on the board layout. to minimize the effective r th(j-a) , all pins must have a solid connection to larger cu layer areas for example to the power and ground layer. in multi-layer pcb applications, the second layer should be used to create a large heat spreader area directly below the ldo. if this layer is either ground or power, it should be connected with several vias to the top layer connecting to the device ground or suppl y. avoid the use of solder-stop varnish under the chip [2] use the measurement data given for a rough estimation of the r th(j-a) in your application. the actual r th(j-a) value can vary in applications using different layer stacks and layouts. table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v in voltage on pin in 4 ms transient ? 0.5 +6.0 v p tot total power dissipation [1] -4 0 0m w t stg storage temperature ? 55 +150 ?c t j junction temperature ? 40 +125 ?c t amb ambient temperature ? 40 +85 ?c v esd electrostatic discharge voltage human body model level 6 [2] ? 6kv machine model class 3 [3] - ? 400 v table 6. operating conditions voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit t amb ambient temperature ? 40 +85 c t j junction temperature - +125 c pin in v in voltage on pin in 2.3 5.5 v pin en v en voltage on pin en 0 v in v pin out c l(ext) external load capacitance [1] 1.0 - ? f table 7. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient [1] [2] 250 k/w ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 6 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 8. characteristics [1] v o(nom) = nominal output voltage (device specific). [2] LD6805Kxxp only. table 8. electrical characteristics at recommended input voltages and t amb = ? 40 to +85 ? c; voltages are referenced to gnd (ground = 0 v); unless otherwise specified. symbol parameter conditions min typ max unit ? v o output voltage variation v out < 1.8 v; i out = 1 ma ta m b = + 2 5 c ? 3- +3% ? 30 c ? ta m b ? +85 c ? 4- +4% v out ? 1.8 v; i out = 1 ma ta m b = + 2 5 c ? 2- +2% ? 30 c ? ta m b ? +85 c ? 3- +3% line regulation error ? v o /(v o ?? v i ) relative output voltage variation with input voltage v in = (v out + 0.5 v) to 5.5 v ? 0.1 - +0.1 %/v load regulation error ?? ? ??? o ??? o ) relative output voltage variation with output current 1ma ? iout ? 150 ma 0.0025 0.01 %/ma v do dropout voltage i out =150ma; v in ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 7 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 9. dynamic behavior 9.1 power supply reje ction ratio (psrr) psrr stands for the capability of the regulator to suppress unwanted signals on the input voltage like noise or ripples. for all frequencies 9.2 dropout the dropout voltage is defined as the smallest input to output voltage difference at a specified load current when the regulator operates within its linear region with the pass transistor functioning as a plain resistor. this means that the input voltage is below the nominal output voltage value. a small dropout voltage guaranties lower powe r consumption and efficiency maximization. (1) 1 ma. (2) 50 ma. (3) 100 ma. (4) 200 ma. fig 4. pssr for LD6805K/18p psrr db ?? 20 v out ripple ?? v in ripple ?? -------------------------- log = 018aaa171 -40 -60 -20 0 psrr (db) -80 f (hz) 10 2 10 5 10 4 10 3 (1) (2) (3) (4) ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 8 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 9.3 accuracy the ld6805 series guarantees high accu racy of the nominal output voltage. (1) +85 ? c (2) +25 ? c (3) ?40 ? c fig 5. dropout voltage as a function of temperature for LD6805K/25p i out (ma) 0 200 160 80 120 40 018aaa172 200 100 300 400 v do (mv) 0 (1) (2) (3) (1) i out =1ma (2) i out = 100 ma (3) i out = 150 ma (4) i out = 200 ma fig 6. accuracy for LD6805K/25p t amb (c) -60 140 100 20 60 -20 018aaa173 2.50 2.49 2.51 2.52 v out (v) 2.48 (1) (4) (3) (2) ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 9 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 10. application information 10.1 output capacitor values the ld6805 series requires external capaci tors at the output to guarantee a stable regulator behavior. also an input capacitor is recommended to keep the input voltage stable. these capacitors should not under-ru n the specified minimum equivalent series resistance (esr). the absolute value of the total capacitance attached to the output pin out influences the shutdown time (t sd(reg) ) of the ld6805 series. [1] the minimum value of capacitance fo r stability and correct operation is 0.7 ? f. the capacitor tolerance should be ? 30 % or better over the temperature range. t he full range of operating conditions for the capacitor in the application should be considered during device selecti on to ensure that this minimum capacitance specification is met. the recommended capacitor type is x7r to meet the full device temperature specification of ?40 ? c to +125 ? c. 11. test information 11.1 quality information this product has been qualified in accordance with nx2-00001 nxp semiconductors quality and reliability specification and is suitable for use in consumer applications. table 9. external load capacitor symbol parameter conditions min typ max unit c l(ext) external load capacitance [1] -1.0- ? f esr equivalent series resistance 5 - 500 m ? fig 7. application diagram out out in gnd in en 1f 1f 001aan647 ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 10 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 12. package outline fig 8. package outline sot1194-1 (huson4) references outline version european projection issue date iec jedec jeita sot1194-1 - - - - - - - - - sot1194-1_po 11-01-25 11-05-30 unit (1) mm max nom min 0.55 0.05 0.00 0.152 0.05 0.30 0.25 0.20 1.05 1.00 0.95 0.53 0.48 0.43 1.05 1.00 0.95 0.65 0.2 0.1 a dimensions note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. huson4: plastic thermal enhanced ultra thin small outline package; no leads; 4 terminals; body 1 x 1 x 0.55 mm sot1194-1 a 1 a 3 bdd h ee h 0.53 0.48 0.43 ekl 0.30 0.25 0.20 vw 0.05 y 0.05 y 1 0.05 0 1 mm scale terminal 1 index area d e b a c y c y 1 x detail x a a 1 a 3 43 terminal 1 index area d h l b e h k e ac b v c w 2 1 ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 11 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 13. soldering fig 9. soldering footprint sot1194-1 (huson4) sot1194-1 footprint information for reflow soldering of hxson4 package sot1194-1_fr occupied area solder land solder resist solder land plus solder paste solder paste deposit dimensions in mm remark: stencil of 75 m is recommended. 45 1.55 0.025 0.5 1.2 1.3 0.25 0.65 0.48 0.48 0.2 r = 0.05 r = 0.05 1.15 1.2 ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 12 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 14. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 14.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 14.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 13 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 14.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 10 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 1 0 and 11 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 10 . table 10. snpb eutectic process (from j-std-020c) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 ? 350 < 2.5 235 220 ? 2.5 220 220 table 11. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 14 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 15. abbreviations msl: moisture sensitivity level fig 10. temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 12. abbreviations acronym description esd electrostatic discharge hbm human body model ldo low dropout mm machine model osp organic solderability preservation pcb printed-circuit board psrr power supply rejection ratio rms root mean square rohs restriction of hazardous substances ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 15 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 16. references [1] iec 60134 ? rating systems for electronic tu bes and valves and analogous semiconductor devices [2] iec 61340-3-1 ? methods for simulation of electrostatic effects - human body model (hbm) electrostatic discharge test waveforms [3] jesd22-a115c ? electrostatic discharge (esd) sensitivity testing machine model (mm) [4] nx2-00001 ? nxp semiconductors quality and reliability specification [5] an10365 ? surface mount reflow soldering description 17. revision history table 13. revision history document id release date data sheet status change notice supersedes ld6805_ser v.1 20110922 objective data sheet - - ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 16 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 18. legal information 18.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 18.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 18.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification. ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 17 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 18.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 19. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com ld6805_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. objective data sheet rev. 1 ? 22 september 2011 18 of 19 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma 20. tables table 1. pin description huson4 . . . . . . . . . . . . . . . . . .2 table 2. ordering information . . . . . . . . . . . . . . . . . . . . .2 table 3. type number extensi on of high ohmic output . .3 table 4. type number extensi on of pull-down output . . .3 table 5. limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .5 table 6. operating conditions . . . . . . . . . . . . . . . . . . . . .5 table 7. thermal characteristics . . . . . . . . . . . . . . . . . . .5 table 8. electrical characteristics . . . . . . . . . . . . . . . . . . 6 table 9. external load capacitor . . . . . . . . . . . . . . . . . . . 9 table 10. snpb eutectic process (from j-std-020c) . . . 13 table 11. lead-free process (from j-std-020c) . . . . . . 13 table 12. abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 13. revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 21. figures fig 1. pin configuration for huson4 . . . . . . . . . . . . . . . .2 fig 2. block diagram of LD6805Kx xh . . . . . . . . . . . . . . .4 fig 3. block diagram of LD6805Kx xp . . . . . . . . . . . . . . .4 fig 4. pssr for LD6805K/18p . . . . . . . . . . . . . . . . . . . .7 fig 5. dropout voltage as a function of temperature for LD6805K/25p . . . . . . . . . . . . . . . . . . . . . . . . . .8 fig 6. accuracy for LD6805K/25p . . . . . . . . . . . . . . . . . .8 fig 7. application diagram . . . . . . . . . . . . . . . . . . . . . . . .9 fig 8. package outline sot1194-1 (huson4) . . . . . . .10 fig 9. soldering footprint so t1194-1 (huson4) . . . . . 11 fig 10. temperature profiles for large and small components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 nxp semiconductors ld6805 series low-dropout regulators, low noise, 150 ma ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 22 september 2011 document identifier: ld6805_ser please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 22. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 3.1 ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 recommended operating conditions. . . . . . . . 5 7 thermal characteristics . . . . . . . . . . . . . . . . . . 5 8 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 dynamic behavior . . . . . . . . . . . . . . . . . . . . . . . 7 9.1 power supply rejection ratio (psrr). . . . . . . 7 9.2 dropout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 9.3 accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 application information. . . . . . . . . . . . . . . . . . . 9 10.1 output capacitor values . . . . . . . . . . . . . . . . . . 9 11 test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 11.1 quality information . . . . . . . . . . . . . . . . . . . . . . 9 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 13 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 14 soldering of smd packages . . . . . . . . . . . . . . 12 14.1 introduction to soldering . . . . . . . . . . . . . . . . . 12 14.2 wave and reflow soldering . . . . . . . . . . . . . . . 12 14.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 14.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 15 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 16 references . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 17 revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 18 legal information. . . . . . . . . . . . . . . . . . . . . . . 16 18.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 18.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 18.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 18.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 19 contact information. . . . . . . . . . . . . . . . . . . . . 17 20 tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 21 figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 22 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 |
Price & Availability of LD6805K
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